SMT Wipe Paper

SMT steel mesh wiping paper is made from 55% natural wood pulp + 45% polyester fiber by unique spunlace process, forming a unique wood pulp/polyester double-layer structure, which is strong, durable and efficient decontamination.

Wipe paper is used to remove excess solder paste, adhesives and solvents that can damage printed circuit boards, thus greatly reducing the waste rate, and making more printed circuit boards with better quality at a faster speed.